Prof Ching Ping Wong, Father of Modern Semiconductor Pacakaging, Received 2006 IEEE Components, Packaging and Manufacturing Technology Award
Prof Ching Ping Wong, Mechanical Engineering Department, Father of Modern Semiconductor Packaging, received the 2006 IEEE Components, Packaging and Manufacturing Technology Award. Sponsored by the IEEE Components, Packaging and Manufacturing Technology Society, the award recognizes meritorious contributions to the advancement of components, electronic packaging or manufacturing technologies. The award was presented to Prof Wong on June 1 at the 56th IEEE Electronic Components and Technology Conference in San Diego, California.
About The Hong Kong University of Science and Technology
The Hong Kong University of Science and Technology (HKUST) (www.ust.hk) is a world-class research university that focuses on science, technology and business as well as humanities and social science. HKUST offers an international campus, and a holistic and interdisciplinary pedagogy to nurture well-rounded graduates with global vision, a strong entrepreneurial spirit and innovative thinking. HKUST attained the highest proportion of internationally excellent research work in the Research Assessment Exercise 2014 of Hong Kong’s University Grants Committee, and is ranked as the world’s best young university in Times Higher Education’s Young University Rankings 2019. Its graduates were ranked 16th worldwide and top in Greater China in Global University Employability Survey 2018.
