Dual Degree students participate in a unique international business plan competition in London
"This experience was really really great."
"It's actually a fantastic moment to see we are growing in such a short period of time!"
The competition brought together 41 top students from US, UK, Brazil, Korea and Hong Kong to work on Green Business proposals on "Building a more sustainable Olympics London 2012". Students from the University of Illinois at Urbana Champaign (UIUC), London South Bank University (LSBU), University of Sao Paulo (USP), Seoul National University (SNU) and HKUST T&M Program formed teams with each comprising students from different universities.
The event was not only a competition, but also a real experience in London.
Students visited the Olympic Stadium, Science Museum and Natural History Museum, as well as attended seminars on sustainable development from prominent guest speakers.
Throughout the competition, T&M students shared different cultures with their teammates, and developed team spirit, problem-solving skills, as well as friendship with each other. Students made great progress in business analysis, case study and business presentation through the whole process.
About The Hong Kong University of Science and Technology
The Hong Kong University of Science and Technology (HKUST) (www.ust.hk) is a world-class research university that focuses on science, technology and business as well as humanities and social science. HKUST offers an international campus, and a holistic and interdisciplinary pedagogy to nurture well-rounded graduates with global vision, a strong entrepreneurial spirit and innovative thinking. HKUST attained the highest proportion of internationally excellent research work in the Research Assessment Exercise 2014 of Hong Kong’s University Grants Committee, and is ranked as the world’s best young university in Times Higher Education’s Young University Rankings 2019. Its graduates were ranked 16th worldwide and top in Greater China in Global University Employability Survey 2018.
