The Technology Transfer Center hosts an Intellectual Property Seminar “Challenges in Patenting FinTech, IoT and Blockchain Inventions”
The Technology Transfer Center (TTC) hosted an Intellectual Property (IP) Seminar “Challenges in Patenting FinTech, IoT and Blockchain Inventions” on 22 March 2018 at the Chen Kuan Cheng Forum (LT-H). The seminar featured Daniel Collopy, Principal in the law firm of Spruson & Ferguson (Asia), to provide tips for patenting Fintech, loT and Blockchain Inventions.
The Technology Transfer Center (TTC) hosted an Intellectual Property (IP) Seminar “Challenges in Patenting FinTech, IoT and Blockchain Inventions” on 22 March 2018 at the Chen Kuan Cheng Forum (LT-H). The seminar featured Daniel Collopy, Principal in the law firm of Spruson & Ferguson (Asia), to provide tips for patenting Fintech, loT and Blockchain Inventions.
In the seminar, Mr Collopy gave explicit definition of FinTech, loT and Blockchain Inventions by providing examples for each type of invention. He thus provided tips for patent drafting of these types of inventions, stressing on the “newness” and “usefulness” of the invention over the prior methods.
Presentation material of the seminar is now available on the TTC website: http://ttc.ust.hk/index.php?p=4&sp=48
About The Hong Kong University of Science and Technology
The Hong Kong University of Science and Technology (HKUST) (www.ust.hk) is a world-class research university that focuses on science, technology and business as well as humanities and social science. HKUST offers an international campus, and a holistic and interdisciplinary pedagogy to nurture well-rounded graduates with global vision, a strong entrepreneurial spirit and innovative thinking. HKUST attained the highest proportion of internationally excellent research work in the Research Assessment Exercise 2014 of Hong Kong’s University Grants Committee, and is ranked as the world’s best young university in Times Higher Education’s Young University Rankings 2019. Its graduates were ranked 16th worldwide and top in Greater China in Global University Employability Survey 2018.
